Design Key Points
Injection molds for electronic device enclosures are designed based on product dimensions, structural features, and appearance requirements. Properly plan parting line positions to ensure they don’t affect assembly or aesthetics after molding. Optimize gating system layouts for uniform melt filling in cavities, avoiding defects like weld lines or short shots. Molds must precisely match details like snaps and holes for subsequent assembly.
Precision Control
Mold precision directly determines enclosure quality. Use high - precision machining (e.g., CNC milling, EDM) to control cavity dimensional tolerance within ±0.02mm, ensuring fit clearance with internal components meets design specs. Mold surfaces undergo fine polishing (Ra≤0.8μm) to reduce surface flaws, meeting electronics’ high appearance standards.
Adaptive Upgrades
For electronics’ miniaturization and thin - wall trends, molds adopt multi - cavity structures to boost efficiency. Optimize cooling systems for rapid, uniform cooling of thin - wall enclosures. Select mold materials matching plastic properties: use H13 steel for ABS, increase cavity hardness for PC. Ensure mold lifespan and molding stability.
